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Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In
addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only. T A =25 ° C unless otherwise specified.
Symbol
V DS
LV CC
Parameter
Maximum Drain-to-Source Voltage (V DL -V CTR and V CTR -PG)
Low-Side Supply Voltage
Min.
500
-0.3
Max.
25.0
Unit
V
V
HV CC to V CTR High-Side V CC Pin to Low-Side Drain Voltage
-0.3
25.0
V
HV CC
V AR
V CS
V RT
dV CTR /dt
High-Side Floating Supply Voltage
Auto-Restart Pin Input Voltage
Current-Sense (CS) Pin Input Voltage
R T Pin Input Voltage
Allowable Low-Side MOSFET Drain Voltage Slew Rate
-0.3
-0.3
-5.0
-0.3
525.0
LV CC
1.0
5.0
50
V
V
V
V
V/ns
FLS2100XS
12.0
P D
Total Power Dissipation
(3)
FLS1800XS
FLS1700XS
11.7
11.6
W
FLS1600XS
11.5
Maximum Junction Temperature
Recommended Operating Junction Temperature
T J
T STG
Storage Temperature Range
(4)
(4)
-40
-55
+150
+130
+150
° C
° C
MOSFET Section
V DGR
V GS
Drain Gate Voltage (R GS =1M Ω )
Gate Source (GND) Voltage
FLS2100XS
500
±30
32
V
V
I DM
Drain Current Pulsed
(5)
FLS1800XS
FLS 1700XS
23
20
A
FLS 1600XS
18
FLS2100XS
T C =25 ° C
T C =100 ° C
10.5
6.5
I D
Continuous Drain Current
FLS1800XS
FLS 1700XS
T C =25 ° C
T C =100 ° C
T C =25 ° C
T C =100 ° C
7.0
4.5
6.0
3.9
A
Package Section
FLS 1600XS
T C =25 ° C
T C =100 ° C
4.5
2.7
Torque
Recommended Screw Torque
5~7
kgf·cm
Notes:
3. Per MOSFET when both MOSFETs are conducting.
4. The maximum value of the recommended operating junction temperature is limited by thermal shutdown.
5. Pulse width is limited by maximum junction temperature.
? 2010 Fairchild Semiconductor Corporation
FLS-XS Series ? Rev.1.0.0
4
www.fairchildsemi.com
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